Baku BA-5055 Low Temperature Solder Paste
| Melting Point | 158°C |
| Weight | 35g |
| Microns | 35~45um |
| Temperature of Using | 160~170 |
| Certification | RoHS |
| Usage | Used for LED materials that are not resistant to high temperatures, not recommended for general products |
| Condition | New |
Baku / Tools
The BA-5055 is a specialized low-temperature solder paste designed for high-precision electronic applications. It is ideal for soldering temperature-sensitive components, particularly micro-components like BGA packages, LEDs, and power modules.
Featuring a unique alloy composition, this solder paste operates at a soldering temperature of just 158℃, significantly reducing the risk of thermal damage to components or PCBs often associated with traditional high-temperature soldering. Post-soldering, it delivers bright, full solder joints for a professional finish.
Engineered with precise humidity control, the BA-5055 resists agglomeration, spreads smoothly, and maintains a moderate viscosity. It ensures uniform coating even on small-pitch solder joints, effectively minimizing issues such as false soldering or cold soldering, making it an excellent choice for intricate and sensitive soldering tasks.
Low Temperature Solder Paste BA-5055
- No false soldering, no cold soldering, and high reliability.
- It has good wettability and beautiful solder joints.
- There is very little residue after soldering, no need to clean, and the formula is mild and does not corrode PCB.